The domestic 32-core server CPU has been verified successfully, with 100% independent instruction architecture, and a single machine can support up to four 128-core servers, from Loongson Zhongke

Domestic CPU has made new progress:

Loongson Zhongke announced that it has completed the verification of the first sample chip of the 32-core server CPU.

According to official information, this chip named 3D5000 uses chip technology to package two native 16-core 3C5000 together.

△

Yes, it is the same operation as the Apple M1 Ultra.

In terms of actual running scores, the SPEC CPU2006 Base scores of the 3D5000 single-socket and dual-socket servers exceed 400 and 800 points respectively, and it is estimated that the score of the four-socket server can reach 1600 points.

It is worth mentioning that 3D5000 continues the LGA package of 3C5000.

Compared with the previous BGA packaging method that needs to solder the chip on the motherboard, the LGA packaging allows the CPU to be disassembled and replaced, which is more suitable for the current market demand.

so–

What is the specific level of Loongson 3D5000?

From the official information, this is a “glue” 32-core server CPU.

To put it bluntly, it is to put two 16-core CPUs together.

Such operations based on advanced packaging technologies have become commonplace in recent years.

For example, Apple’s most powerful chip M1 Ultra, which the outside world talks about, is assembled from two M1 Max chips.

△

In terms of parameters, the chip size of Loongson 3D5000 is 75.4mm×58.5mm×6.5mm, and the frequency is 2.0GHz-2.2GHz.

In terms of power consumption, the typical power consumption is less than [email protected], or [email protected], and the TDP power consumption does not exceed [email protected].

In addition, 3D5000 integrates 32 LA464 processor cores and 64MB on-chip shared cache, supports 8 memory access channels that meet the DDR4-3200 specification, and can connect to I/O expansion bridges and build single/dual channels through 5 high-speed HyperTransport interfaces. One-way/four-way server system, the stand-alone system can support up to four-way 128 cores.

That is to say, with the completion of the verification of the 3D5000 prototype chip, the Loongson server product line will go one step further from covering 4 cores to 4-way 128 cores.

In addition, according to the currently published paper parameters, Loongson 3D5000 is close to the Xeon server E5 v3/v4 launched by Intel in 2015/2016. However, although the main frequency is close, Intel has Turbo Boost technology, and there is still a big gap between Godson and Godson in terms of frequency.

It is worth mentioning that the “assembled component” of 3D5000 is the Godson 3C5000 officially released by Loongson Zhongke in June this year.

3C5000 is a 16-core server CPU that uses LoongArch instruction set independently developed by Loongson. Its single-chip unixbench score is above 9500, and its double-precision computing capability reaches 560GFlops.

Server chips are used in data centers, cloud computing centers and other scenarios, which are related to information security issues. Therefore, China has been advocating the use of independent and controllable architectures to replace mainstream ARM and x86 architectures.

Loongson Zhongke said that it is expected to provide 3D5000 samples and prototypes to industry chain partners in the first half of 2023.

What is the current situation of Loongson Zhongke?

In July last year, Loongson Zhongke submitted the prospectus, sprinting for the first share of domestic CPU.

On June 24 this year, it officially landed on the Science and Technology Innovation Board, issued 41 million shares at an issue price of 60.06 yuan, and raised a total of 2.46 billion yuan. The funds raised from the listing are mainly used for research and development of advanced process chips and GPUs.

One month after submitting the prospectus, Loongson Zhongke quickly launched the first 3A5000 quad-core processor using LoongArch, Loongson’s own instruction set.

This CPU is aimed at personal PCs and servers at the same time. It adopts 12nm process and the main frequency is 2.3GHz-2.5GHz. Each core adopts 64-bit GS464 architecture, including 4 fixed-point units, 2 256-bit vector operation units and 2 memory access units. .

UnixBench running score results, the 3A5000 multi-core level exceeds 4200, and the single-core level exceeds 1600, starting to approach the mainstream chip level in the market.

Based on 3A5000, Loongson Zhongke also launched the server chip 3C5000L. It is packaged by four 3A5000 to form a 16-core processor, which can provide support for cloud computing and data centers.

In terms of financial reports, in the third quarter of this year, Loongson Zhongke’s revenue for the quarter was about 136 million, a year-on-year decrease of 35.73%, and the net profit loss attributable to the parent was 15.715 million yuan, a year-on-year decrease of 154.55%.

The revenue in the first three quarters of this year was 4.83 billion yuan , a year-on-year decrease of 37.55% , and the net profit attributable to the parent was 73.048 million yuan , a year-on-year decrease of 38.6% ; the non-net profit loss was 122 million yuan .

According to current stock price estimates, the market value of Loongson Zhongke is about 34.58 billion.

In terms of ecology, after adopting its own instruction set, LoongArch began to actively complete compatibility and adaptation with domestic and foreign platforms.

For example, the .NET open source community, Linux kernel 5.19, OpenHarmony, etc., have now completed preliminary or formal support for the LoongArch architecture. Just a few days ago, OpenCV, an open source platform for computer vision and machine learning software, just completed official support for the LoongArch architecture.

This also paves the way for Godson to further open up the consumer market.

Recently, with the successful verification of the first sample of the 32-core server chip 3D5000, Longke SMIC’s multi-core capabilities have been further verified, and many netizens are also very excited.

△

According to official disclosures, the next-generation 6000 series chips will adopt a new micro-architecture and provide IPC equivalent to AMD Zen 3. Compared with the existing 5000 series, the simulation performance is improved by 30% in fixed-point performance and 60% in floating-point performance.

As far as IPC is concerned, Loongson 3A5000 can approach ARM chip (7nm) or even Core i7-10700 in terms of single-core performance.

This new series is expected to be launched in 2023.

Reference link: [1]https://mp.weixin.qq.com/s/deIaXlnvhow8xgCwiU3vtQ[2]https://mp.weixin.qq.com/s/MvdkvbHcHYguQRbgxW6WrA[3]https://wccftech.com/ china-domestic-chip-manufacturer-loongson-targets-amds-zen-3-powered-ryzen-with-its-next-gen-cpus-by-2023/[4]https://ift.tt/tUisVqY /508069963/answer/2287490625

This article is from the WeChat public account “Qubit” (ID: QbitAI) , author: Mingmin Yuyang, 36 Krypton is authorized to publish.

media reports

Sohu Fast Technology Sohu Technology 36Kr Phoenix Technology
related events

This article is transferred from: https://readhub.cn/topic/8m8B9aHUYOO
This site is only for collection, and the copyright belongs to the original author.