Recently, Huafeng Technology, an advanced packaging and placement equipment company, completed a B2 round of financing of nearly 50 million US dollars. The financing funds will be mainly used for factory investment, marketing and R & D investment. Investors in this round include Chengchuang Capital, Tongchuang Weiye, Hillhouse Capital, and Shangqi Capital. Hanergy Investment is the main financial advisor for this financing.
Founded in Hong Kong in 2014, Huafeng Technology is a high-end equipment manufacturer focusing on the field of advanced packaging equipment, and is committed to providing customers with advanced semiconductor packaging product technologies and solutions. At present, it has branches in Singapore, Taiwan, the Philippines, Beijing and other places. The company is positioned in the field of semiconductor advanced packaging, and provides a new generation of semiconductor assembly and packaging equipment for semiconductor back-end processes.
The company has a number of independent innovation technology patents, and its main products are characterized by high precision, high speed and high stability. Product modular customization can flexibly meet customer customization needs, and provide customers with after-sales service, and respond quickly to plant-based service needs.
The clients served by the company include TSMC, ASE, Siliconware, JCET, Tongfu Microelectronics, DeeTee, etc. The company’s products have achieved comprehensive coverage of advanced packaging and placement processes, including FOWLP (Face Up/Down), POP, MCM, EMCP, Stack Die, SIP, 2.5D/3D, FCCSP, FCBGA, etc.
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