At CES 2023, AMD demoed a behemoth: the APU MI300 designed for the data center. AMD’s previous APU products were mainly aimed at consumer grades, such as notebook computers and game consoles. The MI300 is the first data center/HPC class APU product, and with 146 billion transistors, it is the largest and most complex chip AMD has ever built – compared to Intel’s Xeon Max GPU’s 100 billion transistors and Nvidia’s GH100 GPU’s 80 billion transistors. The MI300 includes 24 Zen 4 CPU cores, an undisclosed number of CDNA 3 architecture CUs, and 128GB of HBM3 memory. The MI300 stacks nine 5nm chiplets on top of four 6nm chiplets. Compared with MI250X, the AI training performance of MI300 is more than 8 times, and the product will be launched in the second half of this year.
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