Pinwan, July 1, Changdian Technology stated on the interactive platform that the company can realize 4nm mobile phone chip packaging, as well as integrated packaging of CPU, GPU and RF chips. Changdian said that compared with the traditional chip stacking technology, the advantage of multi-dimensional heterogeneous packaging is that higher-density chip packaging can be achieved by introducing an interposer and its multi-dimensional combination. At the same time, multi-dimensional heterogeneous packaging can optimize the combination through the interposer. Different densities of wiring and interconnection achieve an effective balance of performance and cost.
On June 13, Changjiang Electronics Technology also stated that the company has been cooperating with different wafer fabs on advanced process silicon nodes and carried out related technology research and development and project development with major customers in the industry, and now has 5/7nm wafers. The mass production capacity of the process and support customers to complete the mass production of high-performance computing chips and smart terminal main chip products.
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