Recently, Changsha Chixin Semiconductor Technology Co., Ltd. announced that the company has completed a Pre-A+ round of financing of nearly 100 million yuan in August 2022. This round of investment was led by Huiyou Capital, and followed by Shanghai Yukuai and Hongshi Capital. This round of financing will be mainly used for the mass production and stocking of CX300 products, development of new products and market expansion.
Chixin Semiconductor has deep technical accumulation in the field of UWB chip design, and its first UWB chip product, CX300, has been mass-produced. This chip complies with the IEEE802.15.4a/z standard, FIRA/CCC standard technology, and can be interconnected with existing UWB chips including Apple U1. This chip can be widely used in automobiles, mobile phones, Internet of Things, industry, etc. Scenes.
The person in charge of the Huiyou Capital project said that UWB technology has great competitive advantages in terms of high precision, security and real-time performance, and has a wide range of application scenarios. At present, UWB chips have been applied in the field of car digital keys, and the market space is huge. Chixin Semiconductor focuses on the research and development of UWB chips. We are very optimistic about the research and development capabilities of the Chixin R&D team and the market prospects of UWB. We believe that the Chixin team can seize this huge blue ocean market opportunity, make excellent new products and serve customers well. , to create value for the society.
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Related events
- Chixin Semiconductor completed nearly 100 million yuan of Pre-A+ round of financing2022-10-08
- Xinyuan Semiconductor completes nearly $100 million in Pre-A round financing2021-04-06
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