Chixin Semiconductor received 100 million RMB Pre-A+ round of financing

Chixin Semiconductor is an IoT chip design company, focusing on the research and development of low-power IoT chips. At present, it has completed the prototype development of UWB (Ultra Wide Band) chips, breaking through the low-power and high-performance communication baseband IP, high-performance Accurate positioning IP and analog RF IP and other key technologies required for UWB chips, and obtained related patented technologies. Recently, Chixin Semiconductor announced that it has completed the PreA+ round of financing of nearly 100 million yuan in August 2022. This round of investment was led by Huiyou Capital, and followed by Shanghai Yukuai and Hongshi Capital. This round of financing will be mainly used for the mass production and stocking of CX300 products, development of new products and market expansion.

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