At the Hot Chips 34 conference, Intel introduced the Chiplet package structure that Meteor Lake will use . Similar to AMD, Intel seeks to achieve modularity and reduce costs through the use of Chiplets. Unlike AMD, Intel has made a different set of implementation choices to make Meteor Lake suitable for different customer segments. AMD’s Chiplet approach allows die reuse in server and desktop CPUs, but reuse is currently low in desktop and mobile CPUs. Meteor Lake’s packaging method is more expensive and more difficult to scale, but the benefit is that it can achieve higher IO density and lower power consumption.
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