core point
Semiconductor materials are in the upstream of the semiconductor industry chain and are the underlying foundation of the overall semiconductor industry . In the semiconductor industry chain, semiconductor materials play their unique industrial supporting role in the upstream. According to the process flow of semiconductor manufacturing, semiconductor materials can be divided into two categories: manufacturing materials and packaging materials. Manufacturing materials mainly include silicon wafers, compound semiconductors, photoresists, photomasks, electronic special gases, CMP materials, sputtering targets and wet electronic chemicals for IC manufacturing; packaging materials mainly include packaging substrates, bonding wires , lead frames, plastic packaging materials, etc., for IC packaging testing.
The global semiconductor material market continues to grow, and the growth rate of the mainland market is significantly higher than the global average . According to SEMI statistics, in 2015 the global semiconductor material market size was 43.3 billion US dollars, and it will reach 55.3 billion US dollars in 2020, with a compound growth rate of 5%. The global semiconductor materials market is expected to reach $56.5 billion in 2021. In terms of regions, in 2020, the market size of semiconductor materials in Taiwan, China will be US$12.38 billion, continuing to rank first in the world. The market size of mainland China surpasses that of South Korea to US$9.763 billion, ranking second in the world. In terms of market segment size, silicon wafers are the largest single market, with a market size of US$12.2 billion in 2020, followed by electronic specialties, photomasks, and photoresists.
Domestic manufacturers are accelerating their deployment, and there is a broad space for domestic alternatives . At present, the domestic production rate of semiconductor materials is relatively low, and most of them are concentrated in the low-end fields. There is still a large gap with the international advanced technology level, and there is a broad domestic alternative space. The Sino-US trade friction and the growing domestic demand for high-end semiconductor materials have guided domestic manufacturers to accelerate the layout of product technology research and development and capacity expansion, and achieve technological breakthroughs from 0 to 1 in many fields. Semiconductor materials are expected to usher in domestic production from 1 to N. Alternative acceleration.
The global fab expansion trend is obvious, and the demand for semiconductor materials is ushering in an explosion . From 2017 to 2020, there were 62 new semiconductor production lines in the world, of which 26 were added in mainland China, accounting for 40%. Global semiconductor manufacturers will start construction of 19 new high-capacity fabs by the end of 2021, and start construction of 10 more in 2022. According to the 1-2 year expansion cycle of fabs, new capacity will be added in 2022-2023 It will usher in a concentrated release, driving the growth of demand for semiconductor materials, and the semiconductor material market, which belongs to the late cycle, will usher in an explosion.
Advances in manufacturing processes have driven an increase in the value of semiconductor materials . According to IBS data, each time a node is moved forward, the cost of tape-out will increase by 50%, a large part of which is due to the increase in the value of semiconductor manufacturing materials. Taking photomask as an example, in the 16/14nm process, the cost of the mask used is about 5 million US dollars, and by the 7nm process, the mask cost quickly rises to 15 million US dollars.
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