Expert: Samsung’s expansion may put more pressure on storage prices

According to news from Weibo, Taiwan media “Economic Daily” reported that Samsung is fully committed to advanced manufacturing processes, and the outsourcing trend of chips produced with mature manufacturing processes such as home appliances, mobile phones, and panel peripheral ICs is more certain. Among them, UMC has cooperated with Samsung for many years, and it is reported in the industry that UMC has won a large order for Samsung’s 28nm OLED driver IC. In addition, South Korean media said that Samsung intends to increase the two outsourced foundries of PSMC and World Advanced, so as to meet Samsung’s huge internal production needs of mature process chips.

In addition, the industry revealed that Samsung’s logic chip design department, in accordance with the long-term agreement, will increase OLED panel driver ICs, digital signal processors (ISPs) and other 28nm and 22nm orders next year.

Among them, UMC has undertaken outsourcing orders for Samsung’s mature process for many years. After Samsung released a 28nm image signal processor (ISP) to UMC last year, the two parties cooperated to develop the most advanced 22nm high-voltage process and OEM Samsung’s latest OLED driver. IC (OLED DDI). It is also reported in the market that UMC has won a large order for Samsung’s 28nm OLED driver IC.

PSMC is unique in the production of panel driver ICs and key chips for mobile phones, and is a high-quality partner of Samsung.

For Samsung itself, there is news that next year Samsung will expand the wafer production capacity of DRAM and wafer foundry, and will add at least 10 extreme ultraviolet lithography equipment (EUV). Among them, Samsung’s P3 fab in Pyeongtaek will expand DRAM equipment, which can produce 70,000 pieces of 12-inch wafers per month. The current production capacity of the P3 plant’s DRAM production line is 20,000 pieces per month. Samsung expects to use the new equipment to produce 12nm DRAM.