Gowin Semiconductor received 880 million yuan in B+ round financing

Gowin Semiconductor is an FPGA chip developer. Its main products include GW2A series, GW2A series, etc. At the same time, the company also provides users with MIPI interface matching solutions for semiconductor FPGAs and application solutions for semiconductor GW1N-4 chips. Recently completed a heavy B+ round of financing with a total scale of 880 million yuan. The funds raised in this round will continue to increase investment in technology research and development, market sales, operation management, etc. The solid financial barriers will provide the company with continuous promotion of the localization strategy of FPGA chips. Great help. This round of financing has received strong support from well-known institutions in the industry. The old shareholders also continued to make additional investments.

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