Huicheng Co., Ltd. is a wafer gold bump manufacturer, mainly engaged in the packaging and testing services of display panel “driver IC” gold bumps, and is an important part of the flat panel display (LCD) industry chain. The company has introduced international advanced wafer bump technology and COF/COG IC packaging and testing, and established a world-class liquid crystal display (LCD) driver IC packaging and testing production line to meet the needs of international and domestic markets for integrated circuits. Huicheng shares were listed on the Shanghai Stock Exchange’s Science and Technology Innovation Board today. The company’s stock code is 688403, the issue price is 8.88 yuan per share, and the issue price-earnings ratio is 78.92 times.
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