Source: Fast Technology
Samsung’s 3nm GAA is referred to as “face engineering”, and TSMC’s 3nm FinFET is also not smooth.
Last week, industry experts in mobile phone chips broke the news that TSMC internally decided to abandon the N3 process because customers do not need it, and switched to the N3E process with better mass production costs in the second half of 2023.
According to TSMC’s line diagram, N3 is the company’s first generation of 3nm, and N3E is the second generation.
Today evening (August 29), the same whistleblower revealed that they learned from Apple employees that they were dissatisfied with the performance of Ibiza, the first 3nm project, so they canceled the N3 Ibiza, and the 3nm M3 terminal product will not be seen in the short term. .
On the one hand, this further confirms that TSMC’s N3 process is now a rice-free pot. On the other hand, it also implies that whether it is the A16 processor or M2 Pro/Ultra, etc., it is definitely not 3nm, but 4nm.
Today, only Samsung, TSMC and Intel can actually manufacture advanced processes below 7nm. However, as Moore’s Law slows down and nano-transistors approach the physical limit, the progress looks less and less optimistic.
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- 2022-08-29 TSMC is not good, Apple is dissatisfied with the performance of 3nm M3 chip: directly cut it
- 2022-06-06TSMC ‘s first 2nm factory will start construction in the third quarter of this year
- 2022-04-16It is reported that TSMC may produce 3nm chips for Apple in the second half of 2022
- 2022-03-05TSMC 3nm process technology will be put into production soon: density is 60% higher than 5nm
- 2021-12-03TSMC 3nm trial production first batch of chips to be shipped in early 2023
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