TSMC will hold a 3nm mass production ceremony next week, Taiwan media claim to declare its determination to deeply cultivate Taiwan

A few days ago, TSMC issued an activity notice. It is expected that on December 29, a 3nm mass production and factory expansion ceremony will be held at the new engineering base of Wafer 18 in Tainan Science Park. There will be a beam-raising ceremony.

The industry believes that this move is of great significance because TSMC rarely held physical activities in the past for mass production of advanced processes. According to Taiwan’s media Economic Daily, TSMC expanded its investment in the United States and dispatched engineers to the United States to support it, causing concerns about “de-Taiwanization” and hollowing out Taiwan. The determination to cultivate Taiwan deeply and resolve the doubts of the outside world.

The report pointed out that compared to rival Samsung (Samsung), which announced the mass production of 3nm GAA technology on June 30 this year, and held a grand commemorative event for the delivery of 3nm GAA chip products on July 25 in Hwaseong, Gyeonggi-do, TSMC’s 3nm mass production is nearly half a year late.

Earlier, Wei Zhejia, president of TSMC, once said that the development of 3nm technology is very difficult, and many customers are actively cooperating. TSMC continues to use the FinFET architecture for 3nm. It has been considered for a long time.

Compared with 5nm, the logic density of TSMC’s 3nm process technology will increase by 70%, the speed will increase by 10% to 15% at the same power consumption, and the power consumption will be reduced by 25% to 30% at the same speed. Customers such as Apple and Intel are expected to adopt TSMC’s 3nm process.

It is understood that TSMC’s Nanke Wafer 18 Factory is a 5nm and 3nm production base, of which the 5th to 9th phase of the Wafer 18 Factory is a 3nm production base.

The first phase of the TSMC plant in Arizona, USA, is expected to mass produce 4nm in 2024; the second phase of the project is under construction, and it is expected to produce a 3nm process in 2026. The total investment of the two phases is about 40 billion U.S. dollars. It will produce more than 600,000 wafers per year.

Regarding the doubts about “de-Taiwanization” and hollowing out Taiwan caused by investing in the United States, Wei Zhejia responded with “no door” when he participated in a speech at an event a few days ago. He said that the semiconductor industry uses brain power, and there is a shortage of engineers in most countries; it doesn’t matter where the factory is moved, that place will flourish, “there is no door.”