Engineers build Lego-like AI chips

Using a Lego-like design , MIT engineers have created a stackable, reconfigurable artificial intelligence (AI) chip. The chip building blocks keep devices up-to-date while reducing waste of electronics. The new design uses light instead of physical wires to transmit information through the chip. So you can add as many computational layers and light, pressure and even smell sensors as you want. The researchers call it a Lego-like reconfigurable AI chip because of its infinite scalability depending on the combination of layers. In the new chip design, the researchers paired image sensors with arrays of artificial synapses, and trained each synapse array to recognize certain letters — in this case, M, I, and T. An optical system is fabricated between the arrays to enable communication between layers without the need for physical connections, so chips can be freely stacked and added in any desired way.

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