Rongsi Semiconductor completes Pre-A round of financing

Rongsi Semiconductor is a design developer of wide-bandgap semiconductor silicon carbide power devices, focusing on the design and development of wide-bandgap semiconductor silicon carbide power devices. The company integrates Taiwan and Europe’s silicon carbide manufacturing process platforms, combined with mainland packaging and testing and application solutions, has established a complete supply chain that meets IATF 16949 quality management standards for materials, epitaxy, wafer manufacturing and packaging testing, and independently develops automotive-grade carbide silicon device. Recently, Rongsi Semiconductor completed the Pre-A round of financing. This round of financing was led by Dimension Capital, and followed by Shaanxi Sanyuan Hangke Investment Fund Partnership (Limited Partnership), Nanjing Taihua Equity Investment Management Center (Limited Partnership) and other institutions.

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