Business Times reported that TSMC will begin mass production of 3-nanometer (N3) process chips in September. Wei Zhejia, president of TSMC, previously stated that N3 has a high yield rate and will be mass-produced stably in 2023. An improved version of the N3, the N3E, will be mass-produced in the second half of 2023, with Apple and Intel as major customers. Samsung recently announced the first mass production of 3-nanometer chips, becoming the first semiconductor factory in the industry to use a gate-all-around (GAA) architecture. TSMC’s 3nm chips are still fin field effect transistor (FinFET) architecture, but TSMC has improved it to FINFLEX – allowing designers to use the same design tools on the same wafer to choose the best fin structure to Every key functional block is supported.
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